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ardentconcepts.com

Ardent Concepts | High Bandwidth | High Density | Compression Connectors

High Speed Multicoax Assemblies. Connectors & Interposers. High Speed Multicoax Assemblies. CR – GHz Sockets for BGA/ LGA/ Board to Board. SP – Spring Probe interface. SC – ATE Test: MEMS/ Flex/ Chipscale. High Speed Multicoax Assemblies. TR Blind Mate Test Head Interface. Connectors & Interposers. Chip to Board Connectors. Board to Board Connectors High Bandwidth Compression Mount. Board to Board Specificiations. Flex to Board Specifications. RC Space Transformer Interposer. Chip to Chip Connectors.

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Ardent Concepts | High Bandwidth | High Density | Compression Connectors | ardentconcepts.com Reviews
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High Speed Multicoax Assemblies. Connectors & Interposers. High Speed Multicoax Assemblies. CR – GHz Sockets for BGA/ LGA/ Board to Board. SP – Spring Probe interface. SC – ATE Test: MEMS/ Flex/ Chipscale. High Speed Multicoax Assemblies. TR Blind Mate Test Head Interface. Connectors & Interposers. Chip to Board Connectors. Board to Board Connectors High Bandwidth Compression Mount. Board to Board Specificiations. Flex to Board Specifications. RC Space Transformer Interposer. Chip to Chip Connectors.
<META>
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1 solutions
2 quicklink coaxial connector
3 high performance sockets
4 ic footprint probe
5 product catalog
6 connectors
7 sockets
8 technology
9 industries
10 semiconductors
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solutions,quicklink coaxial connector,high performance sockets,ic footprint probe,product catalog,connectors,sockets,technology,industries,semiconductors,communications,computing,defense,news,about us,ardent careers,management team,get a quote,overview
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Ardent Concepts | High Bandwidth | High Density | Compression Connectors | ardentconcepts.com Reviews

https://ardentconcepts.com

High Speed Multicoax Assemblies. Connectors & Interposers. High Speed Multicoax Assemblies. CR – GHz Sockets for BGA/ LGA/ Board to Board. SP – Spring Probe interface. SC – ATE Test: MEMS/ Flex/ Chipscale. High Speed Multicoax Assemblies. TR Blind Mate Test Head Interface. Connectors & Interposers. Chip to Board Connectors. Board to Board Connectors High Bandwidth Compression Mount. Board to Board Specificiations. Flex to Board Specifications. RC Space Transformer Interposer. Chip to Chip Connectors.

INTERNAL PAGES

ardentconcepts.com ardentconcepts.com
1

Ardent Concepts | High Performance Sockets

http://www.ardentconcepts.com/high-performance-sockets

High Speed Multicoax Assemblies. Connectors & Interposers. High Speed Multicoax Assemblies. CR – GHz Sockets for BGA/ LGA/ Board to Board. SP – Spring Probe interface. SC – ATE Test: MEMS/ Flex/ Chipscale. High Speed Multicoax Assemblies. TR Blind Mate Test Head Interface. Connectors & Interposers. Chip to Board Connectors. Board to Board Connectors. Board to Board Specificiations. Flex to Board Specifications. RC Space Transformer Interposer. Chip to Chip Connectors. QFN Test Socket Specifications.

2

Ardent Concepts | RF Connector & Interposer

http://www.ardentconcepts.com/rf-connector-interposer

High Speed Multicoax Assemblies. Connectors & Interposers. High Speed Multicoax Assemblies. CR – GHz Sockets for BGA/ LGA/ Board to Board. SP – Spring Probe interface. SC – ATE Test: MEMS/ Flex/ Chipscale. High Speed Multicoax Assemblies. TR Blind Mate Test Head Interface. Connectors & Interposers. Chip to Board Connectors. Board to Board Connectors. Board to Board Specificiations. Flex to Board Specifications. RC Space Transformer Interposer. Chip to Chip Connectors. QFN Test Socket Specifications.

3

Ardent Concepts | RF Cable Assemblies

http://www.ardentconcepts.com/rf-cable-assemblies

High Speed Multicoax Assemblies. Connectors & Interposers. High Speed Multicoax Assemblies. CR – GHz Sockets for BGA/ LGA/ Board to Board. SP – Spring Probe interface. SC – ATE Test: MEMS/ Flex/ Chipscale. High Speed Multicoax Assemblies. TR Blind Mate Test Head Interface. Connectors & Interposers. Chip to Board Connectors. Board to Board Connectors. Board to Board Specificiations. Flex to Board Specifications. RC Space Transformer Interposer. Chip to Chip Connectors. QFN Test Socket Specifications.

4

Ardent Concepts | SP

http://www.ardentconcepts.com/spring-probe

High Speed Multicoax Assemblies. Connectors & Interposers. High Speed Multicoax Assemblies. CR – GHz Sockets for BGA/ LGA/ Board to Board. SP – Spring Probe interface. SC – ATE Test: MEMS/ Flex/ Chipscale. High Speed Multicoax Assemblies. TR Blind Mate Test Head Interface. Connectors & Interposers. Chip to Board Connectors. Board to Board Connectors. Board to Board Specificiations. Flex to Board Specifications. RC Space Transformer Interposer. Chip to Chip Connectors. QFN Test Socket Specifications.

5

Ardent Concepts | Medical Devices

http://www.ardentconcepts.com/medical-devices

High Speed Multicoax Assemblies. Connectors & Interposers. High Speed Multicoax Assemblies. CR – GHz Sockets for BGA/ LGA/ Board to Board. SP – Spring Probe interface. SC – ATE Test: MEMS/ Flex/ Chipscale. High Speed Multicoax Assemblies. TR Blind Mate Test Head Interface. Connectors & Interposers. Chip to Board Connectors. Board to Board Connectors. Board to Board Specificiations. Flex to Board Specifications. RC Space Transformer Interposer. Chip to Chip Connectors. QFN Test Socket Specifications.

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LINKS TO THIS WEBSITE

ser.co.jp ser.co.jp

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http://ser.co.jp/03-080-Products.html

4 8 12 16or24ch/ユニットで基板に搭載し、LSI動作波形観測、測定可能. 計測器接続の同軸コネクタは SMK(2.92mm)/SMV(1.85mm)を. ARDENT CONCEPTS 社が提供する 50GHz マルチ同軸コネクタ TR のビデオ. AN101TR-TR Multicoax Series Straight Mount Installation. AN102TR-TR Multicoax Series Care and Maintenance. AN103TR-TR Multicoax Series Interface Removal and Replacement. AN104TR-TR Multicoax Series Environmental Performance. AN105TR-TR Multicoax Series Board Optimization Procedure. AN106TR-TR Multicoax Series Integration with Instrumentation. 20GHz SerDes TX and RX Testing.

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Ardent Concepts | High Bandwidth | High Density | Compression Connectors

High Speed Multicoax Assemblies. Connectors & Interposers. High Speed Multicoax Assemblies. CR – GHz Sockets for BGA/ LGA/ Board to Board. SP – Spring Probe interface. SC – ATE Test: MEMS/ Flex/ Chipscale. High Speed Multicoax Assemblies. TR Blind Mate Test Head Interface. Connectors & Interposers. Chip to Board Connectors. Board to Board Connectors High Bandwidth Compression Mount. Board to Board Specificiations. Flex to Board Specifications. RC Space Transformer Interposer. Chip to Chip Connectors.

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