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Best-Reliable Ambient Intelligent Nano Sensor Systems. 3D Antennae and RF MEMS. Design, Simulation, Reliability. Funded under: 7th FWP (Seventh Framework Programme). Area: Microsystems and Smart Miniaturised Systems (ICT-2009.3.9). Total cost: 15.25 million euro. EU contribution: 10 million euro. Execution: From 2010-09-01 to 2013-08-31. Contract type: Collaborative project. Bringing together heterogeneous integration and nano sensor device technologies will catalyse a new level of performance. e-BRA...

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Best-Reliable Ambient Intelligent Nano Sensor Systems. 3D Antennae and RF MEMS. Design, Simulation, Reliability. Funded under: 7th FWP (Seventh Framework Programme). Area: Microsystems and Smart Miniaturised Systems (ICT-2009.3.9). Total cost: 15.25 million euro. EU contribution: 10 million euro. Execution: From 2010-09-01 to 2013-08-31. Contract type: Collaborative project. Bringing together heterogeneous integration and nano sensor device technologies will catalyse a new level of performance. e-BRA...
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Best-Reliable Ambient Intelligent Nano Sensor Systems. 3D Antennae and RF MEMS. Design, Simulation, Reliability. Funded under: 7th FWP (Seventh Framework Programme). Area: Microsystems and Smart Miniaturised Systems (ICT-2009.3.9). Total cost: 15.25 million euro. EU contribution: 10 million euro. Execution: From 2010-09-01 to 2013-08-31. Contract type: Collaborative project. Bringing together heterogeneous integration and nano sensor device technologies will catalyse a new level of performance. e-BRA...

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e-BRAINS Newsletter

http://www.e-brains.org/news/newsletter

Best-Reliable Ambient Intelligent Nano Sensor Systems. 3D Antennae and RF MEMS. Design, Simulation, Reliability. The biannual e-BRAINS newsletter provides updates on the progress of the research, advertises public events and workshops as well as initiatives undertaken by individual consortium members. The e-BRAINS newsletter is published in digital format only. Click on the links to download the newsletters as PDF file! E-BRAINS Newsletter - Issue 4 - Summer 2012. Recent R&D e-BRAINS publications.

2

Smart Biosensor Grain

http://www.e-brains.org/applications/smartbiosensorgrain

Best-Reliable Ambient Intelligent Nano Sensor Systems. 3D Antennae and RF MEMS. Design, Simulation, Reliability. Biological microchips equipped with arrays of magnetoresistive sensors. Complex biological samples can be analyzed rapidly and on-site. Allow the measurement of multiple biological parameters in parallel. Fully integrated system using 3D integrated TMR-sensor RF chip. NO CABLING: Energy supply and data communication will be done wireless. 2011 e-BRAINS · Contact us.

3

3D Antennae & RF MEMS

http://www.e-brains.org/heterointegration/antennamems

Best-Reliable Ambient Intelligent Nano Sensor Systems. 3D Antennae and RF MEMS. Design, Simulation, Reliability. 3D Integrated Antennae and RF MEMS. Extremely compact RF front-ends with very low power consumption are envisioned by the combination of TSV and RF MEMS. 3D EM simulations of the TSV in high-resistivity silicon (HR-Si) substrate will be used for optimization design and a circuit model of the TSV at RF will be extracted. 2011 e-BRAINS · Contact us.

4

Smart Gas Sensors

http://www.e-brains.org/applications/smartgassensors

Best-Reliable Ambient Intelligent Nano Sensor Systems. 3D Antennae and RF MEMS. Design, Simulation, Reliability. Bringing together heterogeneous integration technologies developed in e-Brains to provide a platform for integrated photonic optical gas sensors with smart characteristics. Inclusion of nanotechnological sensing elements and data links for network formation. Optical and mechanical coupling. Selective as monitoring in industrial applications (gases like CO. CO, Acetone, H.

5

3D Integration

http://www.e-brains.org/heterointegration/integration

Best-Reliable Ambient Intelligent Nano Sensor Systems. 3D Antennae and RF MEMS. Design, Simulation, Reliability. Lead partners: Fraunhofer, IMEC, Infineon, Sensonor, Siemens, SINTEF, Tyndall, 3D-PLUS. Research and technological development to achieve highly-reliable and robust processes for stacking and vertical interconnection of fully processed devices by wafer-level 3D integration of known good dies (KGD). High Performance Interposer Technology. Lead partners: Siemens, Fraunhofer EMFT. Multichip wirin...

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Best-Reliable Ambient Intelligent Nano Sensor Systems. 3D Antennae and RF MEMS. Design, Simulation, Reliability. Funded under: 7th FWP (Seventh Framework Programme). Area: Microsystems and Smart Miniaturised Systems (ICT-2009.3.9). Total cost: 15.25 million euro. EU contribution: 10 million euro. Execution: From 2010-09-01 to 2013-08-31. Contract type: Collaborative project. Bringing together heterogeneous integration and nano sensor device technologies will catalyse a new level of performance. e-BRA...

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