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SISPAD.org
Skip to the navigation. Skip to the content. The SISPAD conference series provides an open forum for the presentation of the latest results and trends in process and device simulation. The conference is the leading forum for Technology Computer-Aided Design (TCAD) and is held alternatingly in the United States, Japan, and Europe in September. The next SISPAD conference will take place in Washington DC, USA. Future and Past Events. Washington DC, USA. N Goldsman und M. Stettler. N Mori and K. Sonoda.
SISPAD.org
Skip to the navigation. Skip to the content. The SISPAD conference series provides an open forum for the presentation of the latest results and trends in process and device simulation. The conference is the leading forum for Technology Computer-Aided Design (TCAD) and is held alternatingly in the United States, Japan, and Europe in September. The next SISPAD conference will take place in Washington DC, USA. Future and Past Events. Washington DC, USA. N Goldsman und M. Stettler. N Mori and K. Sonoda.
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SISPAD 2016
International Conference on Simulation of Semiconductor Processes and Devices 2016. International Conference on Simulation of Semiconductor Processes and Devices 2016. Impressions of SISPAD 2016. September 6-8 Nuremberg, Germany. Impressions of SISPAD 2016. Best Paper Award and Best Poster Award. The International Conference on Simulation of Semiconductor Processes and Devices (SISPAD). The 21st SISPAD conference was held on September 6. 2016 in Nuremberg, Germany. Navigation and Social Media.
