Six Sigma, the Microelectronis Component Specialists, specialize in Robotic Hot Solder Dip, Hot Solder Dip, Ball Attach and Reballing, and Column Attach.
http://www.solderability.com/
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>1,000,000
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Winslow Automation, Inc.
905 Mont●●●●●●●●pressway
Mil●●●tas , CA, 95035
US
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Winslow Automation, Inc.
Pon, Scott
905 Mont●●●●●●●●pressway
Mil●●●tas , CA, 95035
US
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Network Solutions, LLC.
Network Solutions, LLC.
13861 Sun●●●●●●●●●ley Drive
He●●on , VA, 20171
US
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BUY YOUR DOMAIN
24
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NETWORK SOLUTIONS, LLC.
WHOIS : whois.networksolutions.com
REFERRED : http://networksolutions.com
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66.206.166.200
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6.2
Six Sigma: Leader in Lead Tinning and Lead Free Services | solderability.com Reviews
https://solderability.com
Six Sigma, the Microelectronis Component Specialists, specialize in Robotic Hot Solder Dip, Hot Solder Dip, Ball Attach and Reballing, and Column Attach.
solderability.com
Six Sigma: Certifications
http://www.solderability.com/certifications.asp
AS9100C and ISO 9001:2008 Certified. Full QML-Q, V and Y Certification/Qualification. DLA QML Class Q, V, and Y certified for column attach and hot solder dip, a subset of assembly services. Military and Industry Standards Compliance. SIX SIGMA also operates in compliance with the following standards:. SAE AS9003, Inspection and Test Quality System. JESD625, Requirements for Handling ESD Sensitive Devices. ANSI/NCSL Z540, Calibration Laboratories and Measuring and Test Equipment. Dun and Bradstreet (DUNS).
Six Sigma: Leader in Lead Tinning and Lead Free Services
http://www.solderability.com/default.asp
AS9100C and ISO 9001:2008 Certified. Your expert in Robotic Hot Solder Dip (HSD), Column Attach, Ball Grid Array (BGA) to Column Grid Array (CGA) conversions, Ball Attach, BGA Reballing, and Trim and Form. Also Failure Analysis, Bond Pull, Mark Permanency, Ball Shear, XRF, Solderability, and Fine and Gross Leak Testing. Check Out Our Certifications! September 16, 2011. Press Release: Six Sigma Achieves AS9100 Rev C Certification. Mike Mazdeh, San Jose, CA. October 29, 2009. Dale Albright, Milpitas, CA.
Six Sigma: Site Map
http://www.solderability.com/sitemap.asp
AS9100C and ISO 9001:2008 Certified. Ball Attach and Reballing. Ball Attach and Reballing Checklist. Why convert from BGA to CGA? Robotic Hot Solder Dip. Press Releases and News. White Papers and Presentations. Problem with the Site?
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2011
Six Sigma: Leader in Lead Tinning and Lead Free Services
AS9100C and ISO 9001:2008 Certified. Your expert in Robotic Hot Solder Dip (HSD), Column Attach, Ball Grid Array (BGA) to Column Grid Array (CGA) conversions, Ball Attach, BGA Reballing, and Trim and Form. Also Failure Analysis, Bond Pull, Mark Permanency, Ball Shear, XRF, Solderability, and Fine and Gross Leak Testing. Check Out Our Certifications! September 16, 2011. Press Release: Six Sigma Achieves AS9100 Rev C Certification. Mike Mazdeh, San Jose, CA. October 29, 2009. Dale Albright, Milpitas, CA.
Microtronic Lötbarkeitstester Tester – LBT210
Die Zukunft hat begonnen. Lotbadtest mit automatischem Rakel und Behälter für das Oxyd. Lotkugeltest mit 1, 2, 3 and 4 mm und Behälter für verbrauchte Kugeln. Lotpastentest mittles Leiterplatte, Lotpaste und Bauteil mit Lötprofil. Automatisches Testen mehrerer Bauteilbeinchen / Steckerleisten. Testen unter Stickstoffatmosphäre mit Regelung. Modul zum Testen der Klebkraft von Lotpasten. Bull; Dynamische Anpassung des Messberichs. Bull; Automatische, stufenlose Signalverstärkung.
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Solderability Testing Systems - www.SolderabilityTestingSystems.com
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Solder Advocate
Because anyone can solder. August 9th, 2015. How weird is that? I can’t believe it’s been over 3 years since my last post. Actually, I can; I’ve completely neglected this site save for installing the security updates from WordPress. I’ve occasionally (yearly, when the Domain registration comes due) thought about ditching this site altogether, but so far haven’t gone to that extreme. Pretty good, if you ask me! Group Buys are Lots of Work. June 26th, 2012. But because it was so much work, I want to show o...
