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Wafer Coring/Resizing & RIP Processes | Intellectual Property Removal Specialists

Wafer Coring/Resizing and RIP Processes. Intellectual Property Removal Specialists. Laser Services Group (LSG). LSG DEVELOPS CREATIVE SOLUTIONS. To challenging micro-machining problems using Synova Laser Microjet technology to cut and machine a variety of hard brittle materials. We specialize in wafer coring/resizing, and removal of intellectual property from shuttle runs, or multi-project wafers. Our customers are global and come from Singapore to South Africa. About its customer service.

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American Precision Dicing, Inc.

Paul Moran

642 Gi●●●●●● Court

San●●●ose , California, 95133

United States

1.40●●●●1600
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pa●●●●●●●●@wafer-dicing.com

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American Precision Dicing, Inc.

Paul Moran

642 Gi●●●●●● Court

San●●●ose , California, 95133

United States

1.40●●●●1600
1.40●●●●0999
pa●●●●●●●●@wafer-dicing.com

View this contact

American Precision Dicing, Inc.

Paul Moran

642 Gi●●●●●● Court

San●●●ose , California, 95133

United States

1.40●●●●1600
1.40●●●●0999
pa●●●●●●●●@wafer-dicing.com

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Wafer Coring/Resizing & RIP Processes | Intellectual Property Removal Specialists | wafer-coring-resizing.com Reviews
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Wafer Coring/Resizing and RIP Processes. Intellectual Property Removal Specialists. Laser Services Group (LSG). LSG DEVELOPS CREATIVE SOLUTIONS. To challenging micro-machining problems using Synova Laser Microjet technology to cut and machine a variety of hard brittle materials. We specialize in wafer coring/resizing, and removal of intellectual property from shuttle runs, or multi-project wafers. Our customers are global and come from Singapore to South Africa. About its customer service.
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Wafer Coring/Resizing & RIP Processes | Intellectual Property Removal Specialists | wafer-coring-resizing.com Reviews

https://wafer-coring-resizing.com

Wafer Coring/Resizing and RIP Processes. Intellectual Property Removal Specialists. Laser Services Group (LSG). LSG DEVELOPS CREATIVE SOLUTIONS. To challenging micro-machining problems using Synova Laser Microjet technology to cut and machine a variety of hard brittle materials. We specialize in wafer coring/resizing, and removal of intellectual property from shuttle runs, or multi-project wafers. Our customers are global and come from Singapore to South Africa. About its customer service.

INTERNAL PAGES

wafer-coring-resizing.com wafer-coring-resizing.com
1

Laser Services Group Supporting Services | Wafer Coring/Resizing & RIP Processes

http://wafer-coring-resizing.com/supporting-services

Wafer Coring/Resizing and RIP Processes. Intellectual Property Removal Specialists. We provide a number of services that are part of the laser RIP process. These processes are managed by APD’s Laser Services Group to allow delivery of a turnkey product to our clients. In order to prevent contamination or damage during the laser ablation process a 3-5μm thick photoresist layer is applied to the wafer surface in a clean room environment. Wafer Coring/Resizing and RIP Processes. Proudly powered by WordPress.

2

Laser Services Group Customer Testimonials | Wafer Coring/Resizing & RIP Processes

http://wafer-coring-resizing.com/testimonials

Wafer Coring/Resizing and RIP Processes. Intellectual Property Removal Specialists. American Precision Dicing is very proud of our reputation for speed and accuracy. However, we believe our customer service is what sets us apart. Here are a few statements from some folks who agree with us. 8220;…works hard to meet our aggressive deadlines and our always changing demands. 8220;…The engineering service is meticulous and precise, and the communication feedback is great…”. Proudly powered by WordPress.

3

Intellectual Property Removal , Shuttle Runs, Multi-Project Wafers | Wafer Coring/Resizing & RIP Processes

http://wafer-coring-resizing.com/ip-removal

Wafer Coring/Resizing and RIP Processes. Intellectual Property Removal Specialists. Some Integrated Circuit foundries can place several designs from multiple customers on one wafer called a. This sharing of wafer masks saves customers money because IC fabrication costs are very high. Foundries also use the term “shuttle runs” in reference to. Removal of Intellectual Property. Is a laser process LSG developed to remove other customers’ integrated circuit designs from an. A detailed inspection is performed.

4

Project Images | Wafer Coring/Resizing & RIP Processes

http://wafer-coring-resizing.com/project-images

Wafer Coring/Resizing and RIP Processes. Intellectual Property Removal Specialists. Wafer Coring/Resizing and RIP Processes. Proudly powered by WordPress.

5

LSG Wafer Coring and Resizing Details | Wafer Coring/Resizing & RIP Processes

http://wafer-coring-resizing.com/wafer-coring

Wafer Coring/Resizing and RIP Processes. Intellectual Property Removal Specialists. Silicon Wafer Coring Example. A 200mm silicon wafer that has been cut into two 100mm wafers with multiple wafer flats. The major wafer flats have been aligned to the original wafer’s notch. We core silicon, germanium, gallium arsenide, indium phosphide, graphite, silicon carbide, diamond coated wafers, stainless steel wafers, and many others. LSG’s Coring and Wafer Processing Details:. A detailed inspection is performed.

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Wafer Coring/Resizing and RIP Processes. Intellectual Property Removal Specialists. Laser Services Group (LSG). LSG DEVELOPS CREATIVE SOLUTIONS. To challenging micro-machining problems using Synova Laser Microjet technology to cut and machine a variety of hard brittle materials. We specialize in wafer coring/resizing, and removal of intellectual property from shuttle runs, or multi-project wafers. Our customers are global and come from Singapore to South Africa. About its customer service.

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